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  www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 1/18 8.feb.2013 rev.001 tsz22111 ? 14? 001 datashee t operational amplifiers low voltage operation ground sense operational amplifiers tlr341g general description tlr341g is single cmos op-amp with shutdown function, low supply voltag e operation and output full swing. there are suitable for battery equipment. mos-fet input stage provide low input bias current. it is capable to use for sensor applications. features ? low operating supply voltage ? full swing output swing ? high large signal voltage gain ? low input bias current ? low supply current ? low input offset voltage applications ? customer electronics ? buffer ? active filter ? mobile equipment ? battery equipment simplified schematic key specifications ? low operating supply voltage (single supply): +1.8v to +5.0v ? low supply current: 70ua ? low shutdown current: 0.2na (typ.) ? high voltage gain (rl=2k ? ): 105db(typ.) ? wide temperature range: -40c to +85c ? turn on time from shutdown: 5 s (typ.) ? low input offset voltage: 4mv (max.) ? low input bias current: 1pa (typ.) ? gain bandwidth: 2.3mhz (typ.) ? slew rate: 0.9v/s (typ.) package w(typ.) xd(typ.) xh(max.) ssop6 2.90mm x 2.80mm x 1.25mm -in +in v b i a s 1 class ab control out v b i a s 2 vdd shutdown control vss shdn figure 1. simplified schematic (1 channel only) product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays.
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 2/18 8.feb.2013 rev.001 tsz22111 ? 15? 001 tlr341g pin configuration tlr341g : ssop6 pin no. pin name 1 +in 2 vss 3 -in 4 out 5 shdn ?????? 6 vdd package ssop6 tlr341g shutdown pin input condition state shdn ?????? vss shutdown vdd active note: please refer to electrical characteri stics regarding the turn on and off voltage. ordering information t l r 3 4 1 g - t r part number tlr341 package g:ssop6 packaging and forming specification tr: embossed tape and reel (ssop6) line-up topr package operable part number -40c to +85c ssop6 reel of 3000 TLR341G-TR absolute maximum ratings (ta=25c) parameter symbol ratings unit supply voltage vdd-vss +5.5 v power dissipation pd 675 *1*2 mw differential input voltage *3 vid vdd to vss v input common-mode voltage range vicm (vss ? 0.3) to (vdd + 0.3 ) v operable with low volta ge vopr +1.8 to +5.0 v operating temperature topr - 40 to +85 c storage temperature tstg - 55 to +150 c maximum junction temperature tjmax +150 c note: absolute maximum rating item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 to use at temperature above ta 25c reduce 5.4mw/c. *2 mounted on a fr4 glass epoxy pcb(70mm70mm1.6mm). *3 the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vss. 34 2 16 + - out +in -in vss vdd 5 shdn
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 3/18 8.feb.2013 rev.001 tsz22111 ? 15? 001 tlr341g electrical characteristics: tlr341g (unless otherwise specified vdd=+1.8v, vss=0v, shdn ?????? =vdd) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *4*5 vio 25c - 0.3 4 mv - full range - - 4.5 input offset voltage drift *4 vio/ t 25c - 1.9 - v/c - input bias current *4 ib 25c - 1 - pa - input offset current *4 iio 25c - 1 - pa - supply current idd 25c - 70 150 a - full range - - 200 shutdown current idd_sd 25c - 0.2 1000 na common mode rejection ratio cmrr 25c 60 85 - db vcm=0v to 0.7v power supply rejection ratio psrr 25c 75 95 - db vdd=1.8v to 5.0v input common mode voltage range vicm 25c vss - vdd-1.1 v cmrr 60 db large signal voltage gain av 25c 70 110 - db rl=10k ? to 0.9v - 100 - rl=2k ? to 0.9v maximum output voltage(high) voh 25c - 25 50 mv rl=2k ? to 0.9v - 7 20 rl=10k ? to 0.9v maximum output voltage(low) vol 25c - 22 55 mv rl=2k ? to 0.9v - 14 20 rl=10k ? to 0.9v output source current *6 isource 25c 6 9 - ma out=0v, short current output sink current *6 isink 25c 10 15 - ma out=1.8v, short current slew rate sr 25c - 0.9 - v/ s rl=10k ? , vin=0.7v p-p gain band width gbw 25c - 2.2 - mhz cl=200pf, rl=100k ? unit gain frequency f t 25c - 1.5 - mhz cl=200pf, rl=100k ? phase margin 25c - 55 - deg cl=20pf, rl=100k ? gain margin gm 25c - 7 - db cl=20pf, rl=100k ? input referred noise voltage vn 25c - 33 - hznv/ f=1khz total harmonic distortion + noise thd+n 25c - 0.015 - % vin=1v p-p , f=1khz rl=600 ? av=0db, din-audio turn-on time from shutdown ton 25c - 5 - s - turn on voltage high vshdn_h 25c - 1.2 - v - turn on voltage low vshdn_l - 0.5 - v - *4 absolute value *5 full range: ta=-40c to +85c *6 under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic. shdn ?????? =0v
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 4/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g tlr341g (unless otherwise specified vdd=+5v, vss=0v, shdn ?????? =vdd) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *7*8 vio 25c - 0.3 4 mv - full range - - 4.5 input offset voltage drift *7 vio/ t 25c - 1.9 - v/c - input bias current *7 ib 25c - 1 - pa - input offset current *7 iio 25c - 1 - pa - supply current idd 25c - 75 150 a - full range - - 200 shutdown current idd_sd 25c - 0.2 1000 na common mode rejection ratio cmrr 25c 75 90 - db vcm=0v to 3.9v power supply rejection ratio psrr 25c 75 95 - db vdd=1.8v to 5.0v input common mode voltage range vicm 25c vss - vdd-1.1 v cmrr 70 db large signal voltage gain av 25c 80 110 - db rl=10k ? to 2.5v - 105 - rl=2k ? to 2.5v maximum output voltage(high) voh 25c - 25 60 mv rl=2k ? to 2.5v - 7 15 rl=10k ? to 2.5v maximum output voltage(low) vol 25c - 40 60 mv rl=2k ? to 2.5v - 18 30 rl=10k ? to 2.5v output source current *9 isource 25c 60 100 - ma out=0v, short current output sink current *9 isink 25c 80 120 - ma out=2.5v, short current slew rate sr 25c - 1 - v/ s rl=10k ? , vin=2v p-p gain band width gbw 25c - 2.3 - mhz cl=200pf, rl=100k ? unit gain frequency f t 25c - 1.6 - mhz cl=200pf, rl=100k ? phase margin 25c - 55 - deg cl=20pf, rl=100k ? gain margin gm 25c - 7 - db cl=20pf, rl=100k ? input referred noise voltage vn 25c - 33 - hznv/ f=1khz total harmonic distortion + noise thd+n 25c - 0.012 - % vin=1v p-p , f=1khz rl=600 ? , av=0db, din-audio turn-on time from shutdown ton 25c - 15 - s - turn on voltage high vshdn_h 25c - 3.4 - v - turn on voltage low vshdn_l - 1.2 - v - *7 absolute value *8 full range: ta=-40c to +85c *9 under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic. shdn ?????? =0v
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 5/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g description of electri cal characteristics described here are the terms of electric characteristics used in this datasheet. items and symbols used are also shown. note that item name and symbol and t heir meaning may differ from those on anot her manufacture?s document or general document. 1. absolute maximum ratings absolute maximum rating item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 power supply voltage (vdd/vss) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruct ion of characteristics of internal circuit. 1.2 differential input voltage (vid) indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of ic. 1.3 input common-mode voltage range (vicm) indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. input common-mode voltage range of the maximum ratings not assures normal operation of ic. when normal operation of ic is desired, the input common-mode voltage of characteristics item must be followed. 1.4 power dissipation (pd) indicates the power that can be consumed by specified mounted board at t he ambient temperature 25 (normal temperature). as for package product, pd is determined by the temper ature that can be permitted by ic chip in the package (maximum junction temperature) and t hermal resistance of the package. 2.electrical characteristics item 2.1 input offset voltage (vio) indicates the voltage difference between non-inverting terminal and inverting terminal. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2.2 input offset voltage drift ( vio/ t) denotes the ratio of the input offset voltage fluc tuation to the ambient te mperature fluctuation. 2.3 input bias current (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 input offset current (iio) indicates the difference of input bias current bet ween non-inverting terminal and inverting terminal. 2.5 supply current (idd) indicates the ic current that flows under specified conditions and no-load steady status. 2.6 shutdown current (idd_sd) indicates the current when the circuit is shutdown. 2.7 common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) 2.8 power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volt age)/(input offset fluctuation) 2.9 input common-mode voltage range (vicm) indicates the input voltage range where ic operates normally. 2.10 large signal voltage gain (av) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage) / (differential input voltage) 2.11 maximum output voltage(high) / ma ximum output voltage(low) (voh/vol) indicates the voltage range that can be out put by the ic under specified load cond ition. it is typically divided into maximum output voltage high and low. maximum output vo ltage high indicates the upper limit of output voltage. maximum output voltage low indicates the lower limit. 2.12 output source current/ output sink current (isource / isink) the maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. the output source current indicates the current flo wing out of the ic, and the output sink current the current flowing into the ic. 2.13 slew rate (sr) sr is a parameter that shows movement speed of operational amplifier. it indicates rate of variable output voltage as unit time. 2.14 gain band width (gbw) indicates to multiply by the frequency and the gai n where the voltage gain decreases 6db/octave. 2.15 unity gain frequency (f t ) indicates a frequency where the voltage gain of operational amplifier is 1.
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 6/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g 2.16 phase margin ( ) indicates the margin of phase from 180 de gree phase lag at unity gain frequency. 2.17 gain margin (gm) indicates the difference between 0db and the gain wher e operational amplifier has 180 degree phase delay. 2.18 input referred noise voltage (vn) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. 2.19 total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. 2.20 turn on time from shutdown (ton) indicates the time from applying the voltage to shutdown terminal until the ic is active. 2.21 turn on voltage / turn off voltage (vshdn_h/ vshdn_l) the ic is active if the shutdown terminal is applied more than turn on voltage (vshdn_h). the ic is shutdown if the shutdown terminal is applied less than turn off voltage (vshdn_l).
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 7/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g typical performance curves tlr341g 40 60 80 100 120 -50 -25 0 25 50 75 100 ambient temperature [ ] supply current [ a] 0 20 40 60 80 100 120 123456 supply voltage [v] supply current [ a] 1.5 2 2.5 3 3.5 4 4.5 5 5.5 123456 su ppl y vol tage [v] output voltage high [v] -40 25 85 figure 3. supply current ? supply voltage 1.8v 5.0v figure 4. supply current ? ambient temperature figure 5. maximum output voltage high ? supply voltage (rl=2k ? ) -40 25 85 0 200 400 600 800 0255075100 ambient temperature [ ] power dissipation [mw] figure 2. derating curve 85 tlr341g (*)the data above is measurement value of typical sample, it is not guaranteed.
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 8/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g typical performance curves (reference data) ? continued tlr341g 0 5 10 15 20 25 -50-25 0 255075100 ambient temperature [ ] output voltage low [mv] 0 2 4 6 8 10 12 14 00.511.52 ou tpu t vol tage [v] output source current [ma] 0 1 2 3 4 5 6 -50-25 0 255075100 ambient temperature [ ] output voltage high [v] 0 5 10 15 20 25 123456 supply voltage [v] output voltage low [mv] -40 25 85 -40 25 85 figure 9. output source current ? output voltage (vdd=1.8v) figure 6. maximum output voltage high ? ambient temperature (rl=2k ? ) 5.0v 1.8v figure 7. maximum output voltage low ? supply voltage (rl=2k ? ) figure 8. maximum output voltage low ? ambient temperature (rl=2k ? ) 5.0v 1.8v (*)the data above is measurement value of typical sample, it is not guaranteed.
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 9/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g typical performance curves (reference data) ? continued tlr341g -4 -3 -2 -1 0 1 2 3 4 123456 supply voltage [v] input offset voltage [mv] 0 5 10 15 20 25 0.0 0.5 1.0 1.5 2.0 ou tpu t vol tage [v] output sink current [ma] 0 10 20 30 40 50 60 70 80 90 100 110 -50 -25 0 25 50 75 100 ambient temperature [ ] output source current [ma] figure 10. output source current ?ambient temperature (out=0v) -40 25 85 figure 11. output sink current ? output voltage (vdd=1.8v) 0 20 40 60 80 100 120 140 -50-250 255075100 ambient temperature [ ] output sink current [ma] figure 12. output sink current ? ambient temperature (out=vdd) figure 13. input offset voltage ? supply voltage (*)the data above is measurement value of typical sample, it is not guaranteed. 25 -40 85 5.0v 1.8v 5.0v 1.8v
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 10/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g typical performance curves (reference data) - continued tlr341g -4 -3 -2 -1 0 1 2 3 4 -50-25 0 25 50 75100 ambient temperature [ ] input offset voltage [mv] 60 70 80 90 100 110 120 130 140 -50-25 0 25 50 75100 ambient temperature [ ] large signal voltage gain [db] . 60 70 80 90 100 110 120 130 140 123456 supply voltage [v] large signal voltage gain [db] . -40 25 85 figure 15. input offset voltage ? input voltage (vdd=1.8v) figure 14. input offset voltage ? ambient temperature figure 17. large signal voltage gain ? ambient temperature (rl=2 k ? ) -40 25 85 figure 16. large signal voltage gain ? supply voltage (rl=2 k ? ) 5.0v 1.8v 5.0v 1.8v (*)the data above is measurement value of typical sample, it is not guaranteed. -4 -3 -2 -1 0 1 2 3 4 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 input voltage [v] input offset voltage [mv]
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 11/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g typical performance curves (reference data) ? continued tlr341g 60 70 80 90 100 110 120 130 140 -50-25 0 25 50 75100 ambient temperature [ ] common mode rejection ratio [db ] 60 70 80 90 100 110 120 130 140 123456 supply voltage [v] common mode rejection ratio [db ] 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 ambient temperature [ ] slew rate l-h [v/ s] -40 25 85 figure 18. common mode rejection ratio ? supply voltage (vdd=1.8v) 60 80 100 120 -50-250 255075100 ambient temperature [ ] power supply rejection ratio [db] figure 20. power supply rejection ratio ? ambient temperature (vdd=1.8v ~ 5.0v) figure 19. common mode rejection ratio ? ambient temperature figure 21. slew rate l-h ? ambient temperature (*)the data above is measurement value of typical sample, it is not guaranteed. 5.0v 1.8v 5.0v 1.8v
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 12/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g typical performance curves (reference data) - continued tlr341g 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 00.511.52 shutdown voltage [v] output voltage [v] 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 ambient temperature [ ] slew rate h-l [v/ s] figure 22. slew rate h-l ? ambient temperature 0 20 40 60 80 100 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency [hz] gain[db] 0 50 100 150 200 phase [deg] phase gain figure 23. voltage gain, phase ? frequency (vdd=1.8v, 25 ) 5.0v 1.8v 0 1 2 3 4 0123456 shutdown voltage [v] output voltage [v] figure 25. turn on/off voltage ? supply voltage (vdd=5v, av=0db, vin=2.5v) vshdn_l vshdn_l vshdn_h vshdn_h (*)the data above is measurement value of typical sample, it is not guaranteed. 10 3 10 4 10 5 10 6 10 7 10 8 figure 24. turn on/off voltage ? supply voltage (vdd=1.8v, av=0db, vin=0.5v)
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 13/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g application information null method condition for test circuit 1 vdd, vss, ek, vicm unit:v parameter vf s1 s2 s3 vdd vss ek vicm calculation input offset voltage vf1 on on off 2.4 0 -1.2 0.5 1 large signal voltage gain vf2 on on on 5 0 -0.5 2.5 2 vf3 -3.5 common-mode rejection ratio (input common-mode voltage range) vf4 on on off 6 0 -3 0 3 vf5 5 power supply rejection ratio vf6 on on off 2.4 0 -1.2 0.5 4 vf7 6.0 calculation 1. input offset voltage (vio) 2. large signal voltage gain(av) 3. common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) vio |vf1| = 1+rf/rs [v] a v |vf2-vf3| = 2 (1+rf/rs) [db] 20log cmrr |vf4 - vf5| = 3 (1+rf/rs) [db] 20log psrr |vf6 - vf7| = 3.2 (1+ rf/rs) [db] 20log vdd rf=50k ri=10k 0.1f rs=50 rl sw3 500k 500k 0.01f e k 15v dut vss vrl 50k vicm sw1 0.1f ri=10k vo vf rs=50 1000pf 0.1f -15v null figure 26. test circuit 1
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 14/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw 6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage rl=10k ? off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off off off on off on off off on unit gain frequency on off off on on off off off on off off on sw1 sw2 sw9 sw10 sw11 sw8 sw6 sw7 cl sw12 sw4 r1 1k r2 100k rl vss vdd=3v vo vin- vin+ sw figure 27. test circuit 2 figure 28. slew rate input output wave vh vl input wave t input voltage vh vl t v output wave sr= v/ t t output voltage 90% 10%
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 15/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g application example voltage follower inverting amplifier non-inverting amplifier figure 30. inverting amplifier circuit figure 31. non-inverting amplifier circuit for inverting amplifier, vi(b) derating curve voltage gain decided r1 and r2, and phase reversed voltage is output. out is shown next expression. out=-(r2/r1) ?in input impedance is r1. for non-inverting amplifier, in is amplified by voltage gain decided r1 and r2, and phase is same with in. out is shown next expression. out=(1 + r2/r1) ?in this circuit performes high input impedance because input impedance is operational amplifier?s input impedance. figure 29. voltage follower voltage gain is 0 db. this circuit controls output voltage (out) equal input voltage (in), and keeps out with stable because of high input impedance and low output impedance. out is shown next expression. out=in vss out in vdd r 2 r 1 vss r 1 // r2 in out vdd
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 16/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g 0 200 400 600 800 0 25 50 75 100 125 ambient temperature [ ] power dissipation [mw] . power dissipation power dissipation (total loss) indicates the power that can be c onsumed by ic at ta=25(normal temperature).ic is heated when it consumed power, and the temperature of ic ship becomes higher than ambient temper ature. the temperature that can be accepted by ic chip depends on circuit configuration, manufacturing process, and consumable power is limited. power dissipation is determined by the temperature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is typically equal to the maximum value in the storage package (heat dissipation capability). t he maximum junction temperature is typically equal to the maximum value in the storage temperature range. heat generated by consumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates th is heat dissipation capability (hardness of heat release) is called thermal resistance, represented by the symbol ja /w. the temperature of ic insi de the package can be estimated by this thermal resistance. figure 32.(a) shows the model of thermal re sistance of the package. thermal resistance ja, ambient temperature ta, maximum junction temperature tjmax, and power dissipation pd can be calculated by the equation below: ja = (tjmax ta ) / p d /w ????? ( ) derating curve in figure 32.(b) indicates power that can be c onsumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumptio n, package, ambient te mperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 33.(c) show a derating curve for an example of tlr341g. when using the unit above ta=25 , subtract the value above per degree . permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (cooper foil area below 3%) is mounted 5.4 mw/ figure 33. derating curve tlr341g figure 32.thermal resistance and derating 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi (b) derating curve a mbient temperature ta [ ] chip surface temperature tj[ ] package face temperature (a) thermal resistance ja=(tjmax-ta)/pd /w (c) tlr341g
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 17/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g operational notes 1) unused circuits when there are unused circuits it is recommended that they are connected as in figure 34., setting the non-inverting input terminal to a potential within input common-mode voltage range (vicm). 2) applied voltage to the input terminal for normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage vdd + 0.3v. then, regardless of power supply voltage, vss-0.3v can be applied to input terminals without deterioration or destruction of its characteristics. 3) power supply (single / dual) the op-amp operates when the specif ied voltage supplied is between vdd and vss. therefore, the si ngle supply op-amp can be used as dual supply op-amp as well. 4) power dissipation pd using the unit in excess of the rated power dissipation may caus e deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. theref ore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a sufficient margin in thermal design. refer to the thermal derating curves for more information. 5) short-circuit between pins and erroneous mounting incorrect mounting may damage the ic. in addition, the presence of foreign particles betwe en the outputs, the output and the power supply, or the output and gnd may result in ic destruction. 6) operation in a str ong electromagnetic field operation in a strong electromagnet ic field may cause malfunctions. 7) ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluct uations in the electrical characteristics due to piezo resistance effects. 8) board inspection connecting a capacitor to a pin with low impedance may stre ss the ic. therefore, discharging the capacitor after every process is recommended. in addition, when attaching and detac hing the jig during the inspec tion phase, ensure that the power is turned off before inspection and removal. furthe rmore, please take measures against esd in the assembly process as well as during transportation and storage. 9) output capacitor discharge of the external output capacitor to vcc is possible via internal parasitic elements when vcc is shorted to vee, causing damage to the internal circuitry due to thermal stress. therefore, when using this ic in circuits where oscillation due to output capacitive load does not occur, such as in vo ltage comparators, use an output capacitor with a capacitance less than 0.1f. designed negative feedback circuit using this ic, ve rify output oscillation caused by capacitive load. 10) latch up be careful of input voltage that exceed the vdd and vss. when cmos device have sometimes occur latch up operation. and protect the ic from abnormaly noise 11) decupling capacitor insert the decupling capacitance between vdd and vss, for stable operation of operational amplifier. 12) shutdown terminal the shutdown terminal can?t be left unconnected. in case shut down operation is not needed, the shutdown pin should be connected to vdd when the ic is used. leaving the shutdown pin floating will result in an undefined operation mode, either shutdown or active, or ev en oscillating between the two modes. connect to vicm figure. 34. the example of application circuit for unused op-amp vdd vss vicm + -
datasheet www.rohm.com tsz02201-0rar1g200620-1-2 ?2013 rohm co., ltd. all rights reserved. 18/18 8.feb.2013 rev.001 tsz22111 ? 15 ? 001 tlr341g 2.4 1.0 0.95 0.6 0.95 physical dimensions tape and reel information marking diagram land pattern data unit mm pkg land pitch e land space mie land length R? 2 land width b2 ssop6 0.95 2.4 1.0 0.6 revision history date revision changes 2013.2.8 001 new release product name package type marking tlr341 g ssop6 bc (unit : mm) ssop6 0.1 s s 0.2min. 0.13 +0.05 ?0.03 4 + 6 ?4 123 654 2.90.2 2.80.2 1.6 +0.2 ?0.1 0.95 1.10.05 0.050.05 1.25max. 0.42 +0.05 ?0.04 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin ssop6(top view) lot number part number marking ssop6
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.


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